Semiconductor device

ABSTRACT

A semiconductor device includes: a semiconductor substrate having a main plane; a semiconductor element provided on the main plane of the semiconductor substrate; an electrode pad provided on the main plane of the semiconductor substrate and connected to the semiconductor element; a guard ring surrounding the semiconductor element and the electrode pad, and provided on the main plane of the semiconductor substrate; and an insulating film covering all region of a semiconductor of the main plane of the semiconductor substrate exposed inside the guard ring, wherein the insulating film is made of a water impermeable material.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a semiconductor device provided withhigh humidity resistance.

Background Art

Rapid progress is being made in universal use of high-frequencysemiconductor devices typified by field-effect transistor elements usingcompound semiconductors such as GaAs, GaN. Regarding high frequencysemiconductor devices, there has been no need to consider influences ofwater from an external environment so far by maintaining a high level ofhermeticity inside packages in which the semiconductor devices aremounted. However, in recent years, since package mounting is performedusing low-priced plastic mold materials, cost reduction is increasinglybeing achieved. Since it is difficult to prevent permeation of waterinto plastic mold materials, how to secure humidity resistance ofsemiconductor devices is becoming an important factor in securingreliability of products.

A semiconductor device is proposed in which a guard ring is constructedof a conductive semiconductor in a peripheral region of a semiconductordevice and part of the guard ring is exposed from an insulating film(e.g., see (FIG. 7 and FIG. 8, p. 29 of) Japanese Patent ApplicationLaid-Open No. 2008-227116).

SUMMARY OF THE INVENTION

When a field-effect transistor (FET) is manufactured according toJapanese Patent Application Laid-Open No. 2008-227116, although it isassumed that it is possible to prevent degeneration of a semiconductorlayer formed in a peripheral portion and prevent an impurity fromintruding into the semiconductor device through a gap between thesemiconductor layer and a protective film, and thereby improve humidityresistance, there are actually cases where the semiconductor of theguard ring exposed from the insulating film is corroded. For thisreason, almost no superiority is found regarding the corrosionphenomenon in the semiconductor layer of the region peripheral to thechip over conventional semiconductor devices that do not adopt theconfiguration of Japanese Patent Application Laid-Open No. 2008-227116.Moreover, corrosion of the semiconductor of the guard ring graduallyadvances toward a drain electrode pad, causing even a metal part of theelectrode pad to be corroded. This also secondarily causes cracking orpeeling of the insulating film that protects the periphery of the pad,degrading the transistor region. This problem is conspicuous in GaNdevices for which high-voltage operation is required.

In view of the above-described problems, an object of the presentinvention is to provide a semiconductor device provided with highhumidity resistance.

According to the present invention, a semiconductor device includes: asemiconductor substrate having a main plane; a semiconductor elementprovided on the main plane of the semiconductor substrate; an electrodepad provided on the main plane of the semiconductor substrate andconnected to the semiconductor element; a guard ring surrounding thesemiconductor element and the electrode pad, and provided on the mainplane of the semiconductor substrate; and an insulating film coveringall region of a semiconductor of the main plane of the semiconductorsubstrate exposed inside the guard ring, wherein the insulating film ismade of a water impermeable material.

In the present invention, the insulating film that covers the wholeregion where the semiconductor of the semiconductor substrate inside theguard ring is exposed is made of a water impermeable material. Thus, itis possible to obtain a semiconductor device provided with high humidityresistance.

Other and further objects, features and advantages of the invention willappear more fully from the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view illustrating a semiconductor deviceaccording to a first embodiment of the present invention.

FIG. 2 is a plan view illustrating the semiconductor device according tothe first embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating the semiconductor deviceaccording to the first embodiment of the present invention mounted in apackage.

FIG. 4 is a cross-sectional view illustrating a semiconductor deviceaccording to a second embodiment of the present invention.

FIG. 5 is a plan view illustrating the semiconductor device according tothe second embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating the semiconductor deviceaccording to the second embodiment of the present invention mounted in apackage.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A semiconductor device according to the embodiments of the presentinvention will be described with reference to the drawings. The samecomponents will be denoted by the same symbols, and the repeateddescription thereof may be omitted.

First Embodiment

FIG. 1 is a cross-sectional view illustrating a semiconductor deviceaccording to a first embodiment of the present invention. FIG. 2 is aplan view illustrating the semiconductor device according to the firstembodiment of the present invention. A semiconductor substrate 1 is anyone of a Si substrate, GaAs substrate, InP substrate, SiC substrate andGaN substrate, and has a multilayered film structure of semiconductorfor performing a predetermined transistor operation.

A semiconductor element 2 is provided on a main plane of thesemiconductor substrate 1. The semiconductor element 2 here is afield-effect transistor element to be used for a high output amplifier,but it may also be a bipolar transistor element or the like. Thesemiconductor element 2 includes a gate electrode 2 a, a sourceelectrode 2 b and a drain electrode 2 c.

A gate electrode pad 3 a, a source electrode pad 3 b and a drainelectrode pad 3 c are provided on the main plane of the semiconductorsubstrate 1 and respectively connected to the gate electrode 2 a, sourceelectrode 2 b and drain electrode 2 c of the semiconductor element 2. Aback metal film 4 is provided on the back of the semiconductor substrate1 and the back metal film 4 is connected to the source electrode pad 3 bvia a via hole 5. A guard ring 6 that surrounds the semiconductorelement 2 and the electrode pads 3 a, 3 b and 3 c is provided in aregion peripheral to the chip on the main plane of the semiconductorsubstrate 1. An insulating film 7 covers all the region of thesemiconductor of the semiconductor substrate 1 exposed from theelectrodes 2 a, 2 b and 2 c, and the electrode pads 3 a, 3 b and 3 cinside the guard ring 6. Note that the region covered with anythingother than the semiconductor such as the gate electrode pad 3 a, thesource electrode pad 3 b and the drain electrode pad 3 c need not becovered with the insulating film 7. These regions need to beelectrically connected to the outside.

In the present embodiment, the guard ring 6 is made of a conductivesemiconductor and the insulating film 7 also covers the whole guard ring6. In the region on the side of the chip outside the guard ring 6, aninter-chip boundary region to be separated from a wafer into individualchips, and the insulating film 7 in the outermost circumferential partof the chip may be opened. The interface between the metal and thesemiconductor on the side of the chip inside the guard ring 6 needs tobe covered with the insulating film.

Here, the insulating film 7 is made of a water impermeable material or amaterial at least more water impermeable than a resin film. For example,it is preferable to use a silicon nitride film or the like capable ofpreventing permeation or diffusion of water as the insulating film 7.The silicon nitride film is often formed using plasma CVD and preferablyformed under a condition similar to Si₃N₄ which is a stoichiometriccomposition. Generally, permeation or diffusion of water of the siliconnitride film fluctuates when it is deviated from a stoichiometriccomposition. For this reason, it is necessary to design a film thicknessof the silicon nitride film enough to prevent water permeation up toeach metal material making up the main plane of the semiconductorsubstrate 1 and transistor for the film forming condition of the siliconnitride film.

FIG. 3 is a cross-sectional view illustrating the semiconductor deviceaccording to the first embodiment of the present invention mounted in apackage. The back metal film 4 of the semiconductor device is joined toa package base material 8 via a solder material 9. Since the packagebase material 8 is given a GND potential (0 V) which is a referencepotential, the source electrode 2 b of the semiconductor device is giventhe reference potential via the via hole 5 and the source electrode pad3 b. The guard ring 6 is also given the reference potential. Nopotential difference is produced in the semiconductor layer outside theguard ring 6, which is kept to 0 V. This prevents corrosion reaction byelectrochemical reaction.

Although a potential difference is produced between the drain electrodepad 3 c which is given a positive potential and the guard ring 6 whichis given the reference potential, since the surface of the semiconductoris protected by the insulating film 7 or the metal electrode pads 3 a, 3b and 3 c, it is possible to eliminate influences of water. Therefore,it is also possible to prevent corrosion of the metal of the electrodepads 3 a, 3 b and 3 c, cracking or peeling of the insulating film 7 orprogression of degradation toward the transistor region, which areincidental to corrosion reaction of the semiconductor.

The insulating film 7 that covers the whole region where thesemiconductor of the semiconductor substrate 1 inside the guard ring 6is exposed is made of a water impermeable material. Thus, it is possibleto obtain a semiconductor device provided with high humidity resistance.

When the guard ring 6 is made of a conductive semiconductor, thesemiconductor of the guard ring 6 also becomes a starting point ofcorrosion reaction. However, the insulating film 7 covers the wholeguard ring 6, and can thereby prevent corrosion reaction.

The semiconductor element 2 may also be an integrated circuit includinga passive element such as resistor, capacitor or inductor. Regarding theregion in which this passive element is formed, the region where thesemiconductor of the semiconductor substrate 1 is exposed is alsocovered with the insulating film 7.

Second Embodiment

FIG. 4 is a cross-sectional view illustrating a semiconductor deviceaccording to a second embodiment of the present invention. FIG. 5 is aplan view illustrating the semiconductor device according to the secondembodiment of the present invention. FIG. 6 is a cross-sectional viewillustrating the semiconductor device according to the second embodimentof the present invention mounted in a package.

In the present embodiment, the guard ring 6 is metallic. The sourceelectrode pad 3 b also serves as part of the guard ring layer. Theinsulating film 7 covers the guard ring 6 and the insulating film 7 onthe source electrode pad 3 b (part of the guard ring 6) is opened. Therest of the configuration is similar to that of the first embodiment.

When the guard ring 6 is metallic, even when part of the guard ring 6 isexposed from the insulating film 7, the semiconductor which becomes astarting point of corrosion reaction is not exposed. Therefore, it ispossible to obtain a semiconductor device with high humidity resistanceas in the case of the first embodiment. Furthermore, when the guard ring6 is metallic, even when the insulating film 7 on the side of the chipoutside the guard ring 6 is opened, no potential difference is producedin the region from which the semiconductor on the side of the chipoutside the guard ring 6 is exposed, which is kept to 0 V, and humidityresistance never deteriorates.

Obviously many modifications and variations of the present invention arepossible in the light of the above teachings. It is therefore to beunderstood that within the scope of the appended claims the inventionmay be practiced otherwise than as specifically described.

The entire disclosure of Japanese Patent Application No. 2014-204754,filed on Oct. 3, 2014 including specification, claims, drawings andsummary, on which the Convention priority of the present application isbased, is incorporated herein by reference in its entirety.

What is claimed is:
 1. A semiconductor device comprising: asemiconductor substrate having a main surface; a semiconductor elementprovided on, and overlaying, the main surface of the semiconductorsubstrate, and including an electrode; an electrode pad provideddirectly on the main surface of the semiconductor substrate andconnected to the semiconductor element; a guard ring provided directlyon the main surface of the semiconductor substrate, the guard ringsubstantially surrounding the semiconductor element and the electrodepad in plan view, wherein the guard ring has a gap relative to theelectrode pad such that the electrode pad serves to close the gap of theguard ring to thereby surround the semiconductor element; an insulatingfilm substantially covering the semiconductor element such that a firstthrough-hole in the insulating film is formed exposing the top surfaceof the electrode, covering the guard ring, and a portion of thesemiconductor substrate inside the guard ring, and substantiallycovering the electrode pad such that a second through-hole in theinsulating film is formed exposing the top surface of the electrode pad,the insulating film being in direct contact with the guard ring and themain surface of the semiconductor substrate in a region where thesemiconductor element is not provided; and a wire connecting theelectrode to the electrode pad, wherein the insulating film is made of awater impermeable material.
 2. The semiconductor device of claim 1,wherein the guard ring is made of a conductive semiconductor and theinsulating film covers the whole guard ring.
 3. The semiconductor deviceof claim 1, wherein the guard ring is metallic.
 4. The semiconductordevice of claim 1, wherein the semiconductor element includes a passiveelement.
 5. The semiconductor device of claim 1, wherein thesemiconductor substrate is any one of a Si substrate, GaAs substrate,InP substrate, SiC substrate and GaN substrate.